banner_na_www_solder9

IS-Wireless, a Polish software developer specializing in LTE, announces acquisition of funds for research on novel spectrum management schemes for Heterogeneous Networks. The funding is done through participation in SOLDER project under the European Union 7th Framework Program. SOLDER stands for “Spectrum Overlay through Aggregation of heterogeneous DispERsed Bands”.

“SOLDER is our second project within the 7FP, after 5GNOW. Here we are going deeper into the network side, extending our core competence of spectrum management into the HetNets and h-RATs. SOLDER received a very high score in extremely competitive last call of the 7FP Future Networks, so we are particularly satisfied. This is our next step on the path towards Horizon2020.” says Dr. Slawomir Pietrzyk, CEO of IS-Wireless.

Goals

The aim of SOLDER is to develop a new spectrum overlay technology, which will provide the efficient aggregation of non-continuous dispersed spectrum bands licensed to heterogeneous networks (HetNets) and heterogeneous Radio Access Technology (h-RATs). The main objectives of the SOLDER project are the following:

  1. To design and develop physical layer techniques for efficient Carrier Aggregation (CA) over HetNets and h-RATs: new transceiver architecture, aggregation algorithms and diversity techniques in non-continuous multi-carrier communications.
  2. To provide efficient medium access control over the HetNets and h-RATs with aggregation capabilities through link adaptation and scheduling approaches. To develop radio resource management exploiting the full potential of heterogeneous carriers.
  3. To efficiently aggregate Heterogeneous Bands used by 3GPP LTE, WiFi and other systems providing seamless and enhanced service delivery. These HetBands might encompass a range of spectrum types and opportunities, including licensed spectrum, license-exempt spectrum, and “white space” among others.

Consortium

SOLDER is a research project comprising 6 partners: